We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Hardening Epoxy Adhesive.
ipros is IPROS GMS ・ IPROS One of the largest technical database sites in Japan that collects information on.

Hardening Epoxy Adhesive - List of Manufacturers, Suppliers, Companies and Products

Hardening Epoxy Adhesive Product List

1～4 item / All 4 items

Displayed results
One-component low-temperature curing epoxy adhesive Seal-glo LTG800

One-component low-temperature curing epoxy adhesive Seal-glo LTG800

Low-temperature (80°C and above) curable thermosetting epoxy adhesive! Ideal for bonding resins with low heat resistance.

Seal-glo LTG800 is a one-component heat-curing epoxy adhesive developed to meet the needs for low-temperature and short-time thermal curing, such as fixing LED backlight lenses and bonding resins (like ABS and acrylic) with a heat resistance of below 100°C. 【Features】 - As a low-temperature curing adhesive, it maintains sufficient adhesive strength at 80°C for 3 minutes. - Being a low-temperature thermal curing adhesive, it can reduce production costs during heating. - It does not run or string when dispensed, maintaining a stable application shape. - It is suitable not only for lens fixation but also for bonding between resins, sealing, and glass adhesion. *For more details, please request materials or view the PDF data available for download.

  • glue
  • LED Module
  • LCD display

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
One-component flexible low-temperature curing epoxy adhesive

One-component flexible low-temperature curing epoxy adhesive

It is a flexible one-component adhesive that can cure at low temperatures and has minimal physical property changes during heating. It is suitable for bonding low-heat-resistant components that require stress relaxation.

The A-8530BKLC is a flexible, low-temperature curing one-component epoxy adhesive that can cure at low temperatures. It improves the hardness changes during thermal history, which were a challenge for conventional flexible epoxy adhesives, achieving both flexibility and reliability during thermal history. It is suitable for applications where silicone cannot be used due to siloxane, as well as for bonding components and structures that require stress relief. 【Features】 - Improves hardness changes during thermal history, achieving both flexibility and reliability during thermal history - Can cure at low temperatures - Low viscosity for excellent workability - Also compliant with low halogen requirements *For more details, please refer to the PDF document or feel free to contact us. Epoxy resin, thermosetting, low temperature, curing, low viscosity, flexible, stress relief, electrical, electrical materials, adhesive, small quantity, custom, customization, electronic components, low halogen, bonding, adhesive.

  • glue

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Epoxy, Etc. Company's 5-minute curing epoxy adhesive 10-3005

Epoxy, Etc. Company's 5-minute curing epoxy adhesive 10-3005

A fast-curing adhesive with high bonding strength that cures in 5 minutes at room temperature. Used for electronic devices and jewelry.

Epoxy, Etc.'s fast-curing epoxy adhesive boasts high bonding strength and excellent applicability to a wide range of materials and uses. The curing time at room temperature is quick, ranging from 5 to 46 minutes, making it ideal for situations where workability is required. The features are as follows: - High bonding strength. - Rapid curing at room temperature (three stages of speed) - Resistance to water and chemicals - Excellent thermal shock resistance - 1:1 mixing ratio - Impact resistant This adhesive is not only effective for bonding various materials but also meets the UL94HB flammability requirements, making it suitable for use in applications with thermal loads.

  • glue

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
COPYRIGHT © 2001-2025 IPROS CORPORATION ALL RIGHTS RESERVED.