One-component flexible low-temperature curing epoxy adhesive
It is a flexible one-component adhesive that can cure at low temperatures and has minimal physical property changes during heating. It is suitable for bonding low-heat-resistant components that require stress relaxation.
The A-8530BKLC is a flexible, low-temperature curing one-component epoxy adhesive that can cure at low temperatures. It improves the hardness changes during thermal history, which were a challenge for conventional flexible epoxy adhesives, achieving both flexibility and reliability during thermal history. It is suitable for applications where silicone cannot be used due to siloxane, as well as for bonding components and structures that require stress relief. 【Features】 - Improves hardness changes during thermal history, achieving both flexibility and reliability during thermal history - Can cure at low temperatures - Low viscosity for excellent workability - Also compliant with low halogen requirements *For more details, please refer to the PDF document or feel free to contact us. Epoxy resin, thermosetting, low temperature, curing, low viscosity, flexible, stress relief, electrical, electrical materials, adhesive, small quantity, custom, customization, electronic components, low halogen, bonding, adhesive.
- Company：レジナス化成
- Price：Other
